India is stepping up its semiconductor push, with the government laying out a clear roadmap to position the country as a global hub for chip design and advanced manufacturing.

Speaking at the World Economic Forum in Davos, IT and Electronics Minister Ashwini Vaishnaw said India’s semiconductor plans have moved from scepticism to strong global confidence.

He said India’s IT industry is set to become the world’s largest AI services provider. This industry is driving the next phase of growth.

Vaishnaw announced that Design Linked Incentive (DLI) 2.0 is under development as part of the Semicon 2.0 programme. This programme has received positive feedback from global industry leaders.

The government has identified six key chip design areas, including compute systems, RF, cyber-secure networking, power management, sensors, and memory.

India is emerging as a global semiconductor design hub. In fact, 50% of global chip design work is expected to be done from India, he said.

Under Semicon 2.0, India aims to build 3nm chip manufacturing capability by 2032. Additionally, India has announced Deep Tech Awards, with the first edition to be held in November 2026.

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